Computer and Peripheral Equipment PCBA Board
Products feature
● -Material: Fr-4
● -Layer Count: 14 layers
● -PCB Thickness: 1.6mm
● -Min. Trace / Space Outer: 4/4mil
● -Min. Drilled Hole: 0.25mm
● -Via Process: Tenting Vias
● -Surface Finish: ENIG
PCB structure characteristics
1. Solderresistant ink (Solderresistant/SolderMask): Not all copper surfaces have to eat tin parts, so the non-tin-eaten area will be printed with a layer of material (usually epoxy resin) that isolates the copper surface from eating tin to avoid non-soldering. There is a short circuit between the tinned lines. According to different processes, it is divided into green oil, red oil and blue oil.
2. Dielectric layer (Dielectric): It is used to maintain the insulation between lines and layers, commonly known as the substrate.
3. Surface treatment (SurtaceFinish): Since the copper surface is easily oxidized in the general environment, it cannot be tinned (poor solderability), so the copper surface to be tinned will be protected. The protection methods include HASL, ENIG, Immersion Silver, Immersion TIn, and organic solder preservative (OSP). Each method has its own advantages and disadvantages, collectively referred to as surface treatment.
PCB Techinecal Capacity
| Layers | Mass production: 2~58 layers / Pilot run: 64 layers |
| Max. Thickness | Mass production: 394mil (10mm) / Pilot run: 17.5mm |
| Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. |
| Min. Width/Spacing | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
| Max. Copper Thickness | UL certificated: 6.0 OZ / Pilot run: 12OZ |
| Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| Max. Panel Size | 1150mm × 560mm |
| Aspect Ratio | 18:1 |
| Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
Our PCBA boards are designed to meet these growing demands by providing high-performance solutions that combine speed, functionality, and efficient information storage/exchange. Whether you are a cloud computing service provider, a big data analyst or a social media platform, our PCBA boards are ideal for you.
The PCBA board is made of high-quality Fr-4 material to ensure durability and reliability. It has 14 layers, providing ample space for components and enabling advanced circuit integration. With a thickness of 1.6mm, it has achieved a perfect balance between compactness and functionality.
We understand the importance of computational precision, which is why we design PCBA boards with a minimum trace/space exterior of 4/4mil. This ensures smooth signal transmission and reduces the risk of interference. at the lowest limit. The 0.25mm drilling size ensures wide application compatibility, making it suitable for various computing scenarios.
To optimize performance and protect the board, we employ a tented via process that prevents any moisture or contaminants from entering the PCB. This ensures greater reliability and longer life for your computing system.
To provide superior connectivity and corrosion resistance, our PCBA boards feature an ENIG finish consisting of a thin layer of gold over nickel. This enables a robust connection and enhances the overall performance of the board.
Our computer and peripheral PCBA boards are the ultimate solution for your computing needs. With its advanced features and premium quality, it guarantees reliable performance and faster information exchange. Stay ahead of the digital revolution with our state-of-the-art PCBA boards.
