One stop electronic Industry Control PCBA board manufacturer

Our Service:

With the rapid development of automatic control devices, industrial robots, and complete intelligent equipment, etc., the networking trend of industrial control system has also integrated many trendy technologies, such as embedding technology, multi-standard industrial control network interconnection, and wireless technology, which have expanded the development space of the industrial control field, and also brought new development opportunities

Send email to us

Product Detail

Product Tags

CAPABILITIES

● -Layer Count: 2L/4L/6L/8L/10L

● -Max. Delivery Panel Size: 699mm×594mm

● -Max. Copper Weight (Inner/Outer Layer): 12oz

● -Max.Board Thickness: 5.0mm

● -Max. Aspect Ratio: 15:1

● -Surface Finish: LF-HASL, ENIG, Imm-Ag, Imm-Sn, OSP, ENEPIG, Gold Finger

Our Services

One-stop PCB and PCBA electronic manufacturing services

1.PCB manufacturing service： Need Gerber file(CAM350 RS274X), PCB files(Protel 99,AD,Eagle),etc

2.Components sourcing services ：BOM list included detailed Part number and Designator

3.PCB assembly services ：The above files and Pick and Place files,assembly drawing

4.Programming & Testing services ：Program,instrouction and test method etc.

5.Housing assembly services： 3D files，step or others

6.Reverse engineering services： Samples and others

7.Cable & wire assembly services ：Specification & others

8.Others services： Value-added services

PCB Techinecal Capacity

Layers	Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness	Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material	FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing	Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness	UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size	Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max. Panel Size	1150mm × 560mm
Aspect Ratio	18:1
Surface Finish	HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control