● Our Services: One-stop PCB and PCBA electronic manufacturing services
● PCB manufacturing service: Need Gerber file(CAM350 RS274X), PCB files (Protel 99, AD, Eagle), etc
● Components sourcing services: BOM list included detailed Part number and Designator
● PCB assembly services: The above files and Pick and Place files, assembly drawing
● Programming & Testing services: Program, instrouction and test method etc.
● Housing assembly services: 3D files, step or others
● Reverse engineering services: Samples and others
● Cable & wire assembly services: Specification & others
● Others services: Value-added services
PCB Technical Capacity
| Layers | Mass production: 2~58 layers / Pilot run: 64 layers |
| Max. Thickness | Mass production: 394mil (10mm) / Pilot run: 17.5mm |
| Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. |
| Min. Width/Spacing | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
| Max. Copper Thickness | UL certificated: 6.0 OZ / Pilot run: 12OZ |
| Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| Max. Panel Size | 1150mm × 560mm |
| Aspect Ratio | 18:1 |
| Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
PCB Technical Capacity
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than 20% | |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
